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CVE Vulnerability Database
Vulnerability Database/CVE-2026-24087

CVE-2026-24087: Qualcomm AR8031 Use After Free Vulnerability

CVE-2026-24087 is a use after free vulnerability in Qualcomm AR8031 Firmware causing memory corruption during fastboot OEM command processing. This article covers the technical details, affected versions, and mitigation.

Published: June 4, 2026

CVE-2026-24087 Overview

CVE-2026-24087 is a memory corruption vulnerability affecting Qualcomm firmware across a broad set of Snapdragon mobile, automotive, IoT, and connectivity platforms. The flaw resides in the fastboot bootloader interface and is triggered while processing OEM commands. Exploitation requires physical access to the device and high privileges, but successful exploitation leads to a scope change with high impact on confidentiality, integrity, and availability. The weakness is categorized under CWE-1286: Improper Validation of Syntactic Correctness of Input. Qualcomm disclosed the issue in the Qualcomm Security Bulletin - June 2026.

Critical Impact

An attacker with physical device access and bootloader privileges can corrupt memory through crafted fastboot OEM commands, enabling code execution within the bootloader and undermining secure boot and device integrity guarantees.

Affected Products

  • Qualcomm Snapdragon mobile platforms including Snapdragon 8 Elite, 8 Elite Gen 5, 8 Gen 2/3, 8+ Gen 2, 7 Gen 4, 7s Gen 3, 6 Gen 1/3/4, 4 Gen 1/2, 695/685/680/662/480/460
  • Qualcomm automotive and robotics platforms including SA8155P, SA8195P, SA8255P, SA8295P, SA8620P, SA8770P, SA9000P, QRB5165N, Robotics RB5, Flight RB5 5G
  • Qualcomm connectivity, XR, wearable, and compute SoCs including FastConnect 6200/6700/6900/7800, Snapdragon XR2/XR2+ Gen 1, Snapdragon W5+ Gen 1, Snapdragon X Elite (X1E80100), and Dragonwing QRU100/X100

Discovery Timeline

  • 2026-06-01 - CVE-2026-24087 published to NVD
  • 2026-06-02 - Last updated in NVD database

Technical Details for CVE-2026-24087

Vulnerability Analysis

The vulnerability exists in the fastboot protocol handler embedded in Qualcomm bootloader firmware. Fastboot exposes an OEM extension namespace that vendors use to add custom commands beyond the standard flash, boot, and getvar operations. The affected handler fails to properly validate the syntactic correctness of incoming OEM command arguments before processing them. This results in memory corruption during command parsing or dispatch.

Because fastboot executes in the bootloader prior to the operating system, code corruption at this stage circumvents kernel-level mitigations, SELinux policies, and runtime exploit guards. The scope change reflects that the bootloader context can influence the subsequent operating environment, including loaded images and verified boot state.

Root Cause

The root cause is improper validation of syntactic correctness of input (CWE-1286) in the fastboot OEM command processing path. The handler accepts command tokens or parameter blobs without enforcing length, structure, or character-set constraints expected by downstream parsing logic. Malformed inputs cause out-of-bounds writes or control-flow corruption within bootloader memory.

Attack Vector

The attack is local and physical. An adversary must place the device in fastboot mode, typically by holding hardware key combinations during power-on, and connect over USB. The attacker must also possess privileges to issue OEM commands, which on production devices generally requires an unlocked bootloader or vendor authentication. Once connected, the attacker issues a malformed fastboot oem <command> request whose arguments trigger the parsing defect and corrupt bootloader memory.

No verified public proof-of-concept exists at the time of publication. The vulnerability mechanism is described in the Qualcomm Security Bulletin - June 2026.

Detection Methods for CVE-2026-24087

Indicators of Compromise

  • Unexpected entries into fastboot or download mode on managed devices, particularly outside of provisioning or service workflows.
  • Bootloader unlock state transitions, verified boot warnings, or dm-verity failures observed in device attestation logs.
  • Firmware version strings or build fingerprints that do not match the approved fleet baseline after a service event.

Detection Strategies

  • Enroll devices in attestation services that validate bootloader lock state, verified boot key, and firmware hash on every check-in.
  • Correlate USB-mode and fastboot-mode events from mobile device management (MDM) telemetry against approved change windows.
  • Track Qualcomm vendor patch level reported by the OS and alert on devices that lag the June 2026 security bulletin.

Monitoring Recommendations

  • Forward MDM, EMM, and remote attestation telemetry into a centralized analytics platform to baseline bootloader state across the fleet.
  • Monitor physical chain-of-custody for high-value devices, including loaner pools, repair returns, and decommissioning queues.
  • Alert on devices reporting an unlocked bootloader, failed verified boot, or downgraded firmware patch level.

How to Mitigate CVE-2026-24087

Immediate Actions Required

  • Inventory all Qualcomm-based devices and map them to the affected chipsets listed in the June 2026 Qualcomm Security Bulletin.
  • Apply OEM firmware updates that incorporate the Qualcomm patch as soon as vendors release them for each device model.
  • Enforce bootloader locking policies through MDM and reject devices reporting an unlocked bootloader from sensitive network zones.
  • Restrict physical access to production handsets, automotive head units, and embedded gateways to authorized personnel only.

Patch Information

Qualcomm has published fixes in the Qualcomm Security Bulletin - June 2026. Downstream OEMs integrate these patches into device-specific firmware images. Administrators should track the Qualcomm vendor patch level field exposed by the operating system and require devices to report the June 2026 patch level or later before granting access to managed resources.

Workarounds

  • Keep bootloaders locked on all production devices; do not enable OEM unlock outside of controlled engineering environments.
  • Disable USB data access in lockscreen and charging policies to reduce the window for fastboot exploitation against unattended devices.
  • Apply tamper-evident seals or secure enclosures on fixed-installation devices such as automotive, robotics, and IoT gateways.
bash
# Configuration example: verify Qualcomm vendor patch level on Android devices via adb
adb shell getprop ro.vendor.build.security_patch
adb shell getprop ro.boot.flash.locked
adb shell getprop ro.boot.verifiedbootstate
# Expected results for a patched, hardened device:
#   ro.vendor.build.security_patch >= 2026-06-01
#   ro.boot.flash.locked = 1
#   ro.boot.verifiedbootstate = green

Disclaimer: This content was generated using AI. While we strive for accuracy, please verify critical information with official sources.

  • Vulnerability Details
  • TypeUse After Free

  • Vendor/TechQualcomm

  • SeverityHIGH

  • CVSS Score7.2

  • EPSS Probability0.02%

  • Known ExploitedNo
  • CVSS Vector
  • CVSS:3.1/AV:P/AC:L/PR:H/UI:N/S:C/C:H/I:H/A:H
  • Impact Assessment
  • ConfidentialityLow
  • IntegrityNone
  • AvailabilityHigh
  • CWE References
  • CWE-1286
  • Vendor Resources
  • Qualcomm Security Bulletin - June 2026
  • Related CVEs
  • CVE-2025-59610: Snapdragon G1 Gen 2 Use-After-Free Flaw

  • CVE-2025-59612: Qualcomm Cologne Use After Free Vulnerability

  • CVE-2026-25260: Qualcomm Cologne Use-After-Free Flaw

  • CVE-2025-47407: Qualcomm Cq7790 Use-After-Free Vulnerability
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