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Vulnerability Database/CVE-2025-47317

CVE-2025-47317: Qualcomm Fastconnect Buffer Overflow Flaw

CVE-2025-47317 is a buffer overflow vulnerability in Qualcomm Fastconnect 6200 Firmware caused by memory corruption when test commands use invalid payload types. This article covers technical details, impact analysis, and mitigation.

Updated:

CVE-2025-47317 Overview

CVE-2025-47317 is a global buffer overflow vulnerability affecting a wide range of Qualcomm firmware components, including FastConnect, Snapdragon mobile platforms, WCN wireless connectivity chips, and WSA/WCD audio codecs. The flaw occurs when a test command is issued with an invalid payload type, triggering memory corruption in a globally allocated buffer. Qualcomm disclosed the issue in the Qualcomm Security Bulletin September 2025. The vulnerability is tracked under CWE-126 (Buffer Over-read) and requires local access with low privileges to exploit.

Critical Impact

A local, low-privileged attacker can corrupt firmware memory to achieve compromise of confidentiality, integrity, and availability on affected Qualcomm chipsets.

Affected Products

  • Qualcomm FastConnect 6200, 6700, and 7800 firmware
  • Qualcomm Snapdragon 6 Gen 1 Mobile Platform and SM-series SoCs (SM6475, SM6650, SM7435, SM7550, SM7635, SM7675, SM8635, SM8735, SM8750, and P-variants)
  • Qualcomm WCN, WCD, WSA, QCC, QMP, and Sound Platform firmware families

Discovery Timeline

  • 2025-09-24 - CVE CVE-2025-47317 published to NVD
  • September 2025 - Qualcomm releases fix in the Qualcomm Security Bulletin September 2025
  • 2026-06-17 - Last updated in NVD database

Technical Details for CVE-2025-47317

Vulnerability Analysis

The vulnerability is a global buffer overflow that is triggered by a test command carrying an invalid payload type. When firmware processes the test command, it fails to validate the payload type against expected values before writing to or indexing into a statically allocated global buffer. This condition maps to CWE-126, which covers buffer over-reads that expose memory beyond the intended boundary, and can also lead to write-side corruption when adjacent structures are overwritten.

Because the affected buffers reside in the firmware's data segment, corruption can influence subsequent command handling, potentially altering control flow or firmware state. Successful exploitation impacts confidentiality, integrity, and availability of the affected chipset subsystem.

Root Cause

The root cause is missing or insufficient validation of the payload type field in a firmware test command handler. The handler dispatches the payload into a fixed-size global buffer without verifying that the type identifier is within the supported range, resulting in out-of-bounds memory access.

Attack Vector

Exploitation requires local access and low privileges on the host system that can issue test commands to the affected Qualcomm firmware interfaces. No user interaction is required. An attacker with the ability to submit crafted diagnostic or test commands, such as through privileged host services interacting with the WLAN, audio, or connectivity subsystems, can trigger the overflow. Remote exploitation over the network is not indicated.

No verified exploitation code is publicly available. Refer to the Qualcomm Security Bulletin September 2025 for vendor technical details.

Detection Methods for CVE-2025-47317

Indicators of Compromise

  • Unexpected crashes, resets, or watchdog events involving WLAN, Bluetooth, or audio subsystems on affected Qualcomm SoCs.
  • Kernel or firmware logs recording malformed test commands or invalid payload type parameters passed to Qualcomm firmware interfaces.
  • Repeated diagnostic command issuance from non-standard or unauthorized user-space processes.

Detection Strategies

  • Monitor host operating system logs (dmesg, logcat, vendor firmware logs) for firmware crash signatures related to FastConnect, WCN, WCD, or WSA components.
  • Audit which processes and privilege levels can invoke diagnostic or test IOCTLs and message interfaces exposed by Qualcomm drivers.
  • Correlate device instability events with the firmware build version to identify unpatched systems still handling malformed test payloads.

Monitoring Recommendations

  • Enforce logging on driver interfaces that accept test or diagnostic commands and alert on invalid payload type values.
  • Track firmware and driver versions across mobile and embedded fleets against the fixed versions listed in the Qualcomm bulletin.
  • Review endpoint telemetry for repeated subsystem restarts, which can indicate exploitation attempts causing memory corruption.

How to Mitigate CVE-2025-47317

Immediate Actions Required

  • Apply the firmware and driver updates published in the Qualcomm Security Bulletin September 2025 as delivered by OEMs.
  • Inventory all devices using affected FastConnect, Snapdragon, WCN, WCD, WSA, and QCC components and prioritize patching.
  • Restrict local access and reduce the attack surface by limiting which user-space processes can invoke test or diagnostic firmware commands.

Patch Information

Qualcomm addressed CVE-2025-47317 in the September 2025 security bulletin. Fixes are distributed to device OEMs, which incorporate the updates into their platform firmware and driver releases. End users should install the most recent OEM firmware update that references the September 2025 Qualcomm patch level.

Workarounds

  • Disable or gate access to firmware test and diagnostic command interfaces where operationally feasible until the patch is deployed.
  • Apply least-privilege controls to limit which local accounts and services can reach the affected firmware IOCTLs and messaging channels.
  • Where supported, deploy Mobile Device Management (MDM) policies to enforce minimum patch levels aligned with the September 2025 Qualcomm bulletin.
bash
# Configuration example: verify Qualcomm patch level on Android devices
adb shell getprop ro.build.version.security_patch
adb shell getprop ro.vendor.build.security_patch
# Ensure the returned patch level is at or after the September 2025 Qualcomm bulletin

Disclaimer: This content was generated using AI. While we strive for accuracy, please verify critical information with official sources.

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